TSM-DS3 2-Layer 20mil Low-Loss Ceramic PCB with Immersion Gold

1.Introduction of TSM-DS3

TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rivals epoxies in fabricating large format complex multilayers.

TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies.

TSM-DS3 was developed for high power applications (TC = 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.

2.Key Features

Dielectric constant of 3.0 with tight tolerance 0.05 at 10 GHz/23°C
Dissipation factor of 0.0014 at 10GHz
High Thermal conductivity (unclad) of 0.65 W/MK
Low Moisture Absorption 0.07%
Matched to copper CTE in X-axis of 10 ppm/°C, Y-axis of 16 ppm/°C and Z-axis of 23 ppm/°C

3.Benefits

Low (~5%) Fiberglass Content
Dimensional Stability Rivals Epoxy
Enables Large Format High Layer Count PCBs
Builds Complex PCBs in Yield w/ Consistency and Predictability
Temperature Stable Dk ± 0.25% (-30 to 120°C)
Compatible With Resistive Foils
Excellent thermal conductivity for high-power applications
Very low CTE for demanding thermal cycling environments

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
TSM-DS3 – 0.508 mm (20 mil)
Copper layer 2 – 35 μm

6.PCB Statistics:

Components: 62
Total Pads: 134
Thru Hole Pads: 69
Top SMT Pads: 65
Bottom SMT Pads: 0
Vias: 94
Nets: 2

7.Typical Applications

Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna/Automotive
Oil Drilling
Semiconductor/ATE Testing

8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide